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everlight electronics co.,ltd. technical data sheet high power led ? 1w ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 1 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh features z feature of the device: small package with high efficiency z typical color temperature: 6500 k. z typical view angle: 110. z typical light flux output: 70lm @ 350ma. z esd protection. z soldering methods: hot bar soldering. z grouping parameter: total luminous flux, color temperature. z typical optical efficiency: 60 lm/w. z thermal resistance (junction to lead): 15 k/w. z the product itself will remain within rohs compliant version applications z tft lcd display backlight z decorative and entertainment illumination z signal and symbol luminaries for orientation marker lights (e.g. steps, exit ways, etc.) z exterior and interior automotive illumination materials items description housing black body heat resistant polymer encapsulating resin silicone resin lens heat resistant clear polymer electrodes ag plating copper alloy die attach eutetic film chip ingan
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 2 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh dimensions notes: 1. dimensions are in millimeters. 2. tolerances unless dimensions 0.25mm.
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 3 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh maximum ratings ( t ambient =25oc ) parameter symbol rating unit operating temperature t opr -40 ~ +100 oc storage temperature t stg -40 ~ +110 oc junction temperature t j 125 oc pulse forward current i f 500 ma power dissipation p d 2.0 w junction to heat-sink thermal resistance r th 15 k/w electro-optical characteristics ( t ambient =25oc ) parameter bin symbol min typ. max unit condition j5 45 ---- 52 k1 52 ---- 60 k2 60 ---- 70 k3 70 ---- 85 luminous flux (1) k4 v 85 ---- 100 lm v1 2.95 ---- 3.25 v2 3.25 ---- 3.55 v3 3.55 ---- 3.85 forward voltage (2) v4 v f 3.85 ---- 4.15 v viewing angle (3) ---- 2 1/2 ---- 110 ---- deg color temperature (4) ---- cct 4500 6300 10000 k i f =350ma note. 1. luminous flux measurement tolerance: 10% 2. forward voltage measurement tolerance: 0.1v 3. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 4. x, y coordination for white light bin areas refer to ehp-a08-ax08 series white and warm white binning (dse-a08-001) .
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 4 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh cool-white bin structure standard specification part number cct range(k) color bins brightness range(lm) ehp-ax08b/ct01c-p01/4556/y/j5k2 4500-5650 v5 v6 u5 u6 45-70 ehp-ax08b/ct01c-p01/5670/y/j5k2 5650-7000 x5 x6 w5 w6 45-70 ehp-ax08b/ct01c-p01/4556/y/k2k3 4500-5650 v5 v6 u5 u6 60-85 ehp-ax08b/ct01c-p01/5670/y/k2k3 5650-7000 x5 x6 w5 w6 60-85 ehp-ax08b/ct01c-p01/4556/y/k3k4 4500-5650 v5 v6 u5 u6 70-100 ehp-ax08b/ct01c-p01/5670/y/k3k4 5650-7000 x5 x6 w5 w6 70-100
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 5 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh relative spectral distribution, i f =350ma, t ambient =25oc forward voltage vs forward current, t a m b i e n t =25oc relative luminous intensity vs forward current , t a m b i e n t =25oc forward current derating curve, deratin g based on t j ma x =125c typical electro-optical characteristics curves 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intenstiy wavelength(nm) 0 200 400 600 800 1000 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 forward voltage (v) forward current ( ma ) 0 100 200 300 400 500 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 relative luminous intensity forward current (ma) 0 20406080100 100 150 200 250 300 350 400 forward current (ma) ambient temperature ( o c )
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 6 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh -80-60-40-20 0 20406080 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 degree ( 2 ) relative luminous intensity typical representative spatial radiation pattern
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 7 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: luminous ranks hue: dominant wavelength ref: reference lot no: lot number made in taiwan: production place tube packing specifications 1. tube 2. inner carton 3. outside carton z packing quantity 1. 60 pcs / per tube 2. 20 tubes / inner carton 3. 12 inner cartons / outside carton
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 8 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh reliability test items and results stress test stress condition stress duration solderability tsol=230 , 5sec 1 times resistance to solder heat tsol=260 , 10sec, 6min 3 times thermal shock h 110 20min. ' 10sec. 'l 40 20min. 500 cycles temperature cycle h 100 30min. ' 5min. 'l 40 30min. 1000 cycles high temperature/humidity reverse bias ta=85 , rh=85% 1000hours high temperature/humidity operation ta=85 , rh=60%, if=225ma 1000hours high temperature storage ta=110 1000hours low temperature storage ta=-40 1000hours intermittent operational life ta=25 , if=1000ma 30ms on/ 2500ms off 1000hours high temperature operation life #1 ta=55 , if=350ma 1000hours high temperature operation life #2 ta=85 , if=225ma 1000hours high temperature operation life #3 ta=100 , if=150ma 1000hours low temperature operation life ta=-40 , if=350ma 1000hours power temperature cycle h 85 15min. ' 5min. 'l 40 15min. if=225ma,2min on/off 1000cycles esd human body model 2000v, interval:0.5sec 3 times esd machine model 200v, interval:0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 50% *vf: forward voltage difference 20%
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 9 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh precautions for use 1. over-current-proof though ehp-a08 has conducted esd protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. storage i. do not open moisture proof bag before the products are ready to use. ii. before opening the package, the leds should be kept at 30 or less and 90%rh or less. iii. the leds should be used within a year. iv. after opening the package, the leds should be kept at 30 or less and 70%rh or less. v. the leds should be used within 168 hours (7 days) after opening the package. vi. if the moisture absorbent material (silicone gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. vii. pre-curing treatment : 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-a08 series led package should be mounted on a metal core printed circuit board (mcpcb) with proper thermal connection to dissipate approximately 1w of thermal energy under 350ma operation. ii. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on al uminum with thermal conductive adhesive, etc. iii. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and led lifetime will decrease critically.
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 10 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh 4. assembly process flow handling indications do not handle the ehp-a08 by the lens at any time during the assembly process. this can cause damage to the optical surfaces or may dislocate the lens if excessive force is applied. 5. soldering iron i. for prototype builds or small series production runs it is possible to place and solder the led by hand. ii. dispensing thermal conductive glue or grease on the substrates and follow its curing spec. press led housing to closely connect led and substrate.
everlight electronics co.,ltd. ehp-ax08b/ct01c-p01 everlight electronics co., ltd. http://www.everlight.com rev.1.0 page: 11 of 11 device no. : dse-8b1-x11 prepared date: may. 06, 2008 prepared by: jessie chueh iii. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. iv. be careful because the damage of the product is often started at the time of the hand solder.

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